The following positions are
looking for 2005’ university graduates
The following positions are
located at Intel offices in Shanghai
Component Design Engineer(FPG)
Responsibility:
Flash design team is looking
for Circuit Design Engineers who would be responsible for developing
circuits on leading-edge process for flash memories catering to
the wireless market. Applicant should have basic technical skills
needed to design, model parasitic, simulate, layout, verify and
debug circuits on Flash memory chips. The candidate would be responsible
for design and verification of analog circuits on Flash design
projects. The candidate should have a strong understanding of analog/digital
transistor-level circuit design, process technology, and device
physics. S/he would be responsible for organizing and planning
their work to meet section deadlines with limited assistance
from a project section leader or supervisor.
Working
knowledge of Cadence design tools, Hspice/Eldo, Unix, and PERL
programming is desirable. The candidate should be self-motivated,
exhibit good written and verbal communication skills, and work
well on a team. BSEE or MSEE required.
Design Integration Engineer(ATD)
Responsibility:
Seeking for a highly motivated
individual to manage the packaging design integration. The position
requires a good appreciation and understanding of physical design,
reliability, thermal, electrical, & mechanical
aspects of packaging, assembly process/manufacturing and cost. Design
Integrators (DI) will work with Intel $B=L (B business unit partners
(ICG, FPG) as well as assembly and test technology development partners
(STTD, SMTD, PTD, CTM) to comprehend product packaging requirements,
assess package technology feasibility and work with internal and/or
external process development teams. The DI will serve as the key
technical liason to ATD customers and partners on design related
issues for package technologies during technology development. Key
deliverables include delivery of design rule and DFM rule sets for
package substrates and silicon, design rules for integrated thermal,
mechanical and electrical performance, co-ordination of product package
as well as product thermal/ mechanical designs and delivery of design/
manufacturing collaterals to Intel business units. Candidate needs
to direct design tradeoffs and drive decision making in a dynamic,
cross functional, team oriented environment.
Requirements:
Successful candidate must have
demonstrated excellent analytical skills, proficiency to balance
technical and business related concerns and ability to manage
and execute projects. Must have good communication skills to present
to staff/ senior management levels. Strong background in Electrical/
Ph.D in ME/EE/Chem.E/ Mat. Sci required. Mechanical engineering
and knowledge of packaging (wire bond, flip chip) is required.
Familiarity with Intel assembly/ test processes and ATD business
process is a plus.
Silicon Integration Engineer (ATD )
Responsibility:
Candidate is responsible for
design and process integration of a variety of advanced IC package
technologies to support Intel’s communication and wireless products
as part of the Assembly Technology Development group. The job
scope includes package technology development that optimizes product
performance, manufacturability and cost. The candidate will work
with assembly and test technology development partners as well
as factories, product divisions, and external package
suppliers to perform job functions in the following areas: definition
and validation of silicon and package design rules, definition and
design of silicon test chips and package test vehicles to validate
key technology parameters, feasibility analysis of package technology
options, and package technology alignment.
Requirements:
The ideal candidate should have
a solid background in semiconductor field and in particular, familiarity
with device and substrate design, fab and assembly processing,
and characterization techniques. Silicon device design experience
is desired. Experience with silicon, package or PCB process technology
development and knowledge of CAD tools is desirable. Experience
with characterization and quality/reliability equipment and techniques
will also be useful. The ability to work on several projects simultaneously
in a multi-disciplinary team environment that usually spans across
multiple geographical locations is also required. It is essential
to have strong communication skills. Desired educational background:
Ph.D. or M.S. in Electrical Engineering or Materials Science and
Engineering or Chemical Engineering or Mechanical Engineering.
Process/Equipment Engineer (TMG)
Responsibility:
Develops new or modified process
formulations, defines processing or handling equipment requirements
and specifications, and reviews processing techniques and
methods applied in the manufacture, fabrication and evaluation
of semiconductors. Reviews product requirements with design staff
to ensure compatibility of processing methods. Compiles and evaluates
test data to determine appropriate limits and variables for process
or material specifications. May conceive and plan projects involving
definition and selection of new concepts and approaches in the
processing or development of new or improved processes in photomasking,
diffusion, deposition, wafer fabrication and device physics. Works
on complex issues where analysis of situations or data requires
an in-depth evaluation of variable factors. Exercises
judgment in selecting methods, techniques and evaluation criteria
for obtaining results.
Requirements: Mechanical & Electrical Engineering major preferred;
Responsibilities:
New equipment installation
for volume ramp up and productivity improvement; enhance engineering
technical capability and develop local content expertise
Product Engineer (TMG)
Responsibility:
Be responsible for products
of the factory. We will have: sort tape development; class
tape development; yield analysis; product validation & failure
analysis / test engineers
Requirements:
EE or communication background
Manufacturing Supervisor (TMG)
Responsibility:
Support manufacturing
and improve productivity, reduce headcount and cost; identify
and resolve manufacturing issues in systematic way; work
on shift
Requirements:
No major requirement
Technical Consultant (ISS) Responsibility:
Be responsible
for designing / packaging and delivering Intel product
based technical solution to customers in e-gov/e-healthcare industry.
The candidate will also need manage the project cycle and
process
Requirements:
Bachelor/Master/PHD major in
Computer Science or Electrical engineering and related field.
Good understanding and experience of e-business solution design
and implementation experience in government or healthcare sector;
Good command of English
Software Engineer (ICSC)
Responsibility:
Working in a software product development/validation
team, the candidate would be responsible for architecting and developing
new software product, writing test suites, performance tuning
etc.
Requirements:
Bachelor/Master/PHD major in
Computer Science or Electrical engineering and related field.
Excellent communications skills, be a team player and demonstrate
good interpersonal skills. Fluent in Chinese and possess good
English communication skills
Hardware Engineer (ICSC)
Responsibility:
Participating in new product development; Representing
the customers technical needs; Creating competitive analysis
from a technical perspective
Requirements:
Bachelor/Master/PHD
major in Electrical engineering or computer engineering and related
field. Ability to work well in a team environment;
Ability to own and drive resolution of technical issues;
Ability to multitask
The following positions
are located at Intel office in Chengdu
Industry Engineer (TMG)
Requirements:
BS/MS in Industrial Engineering preferred.
Will consider degree holders in related fields such as Management
Science or Mathematics Must be able to tolerate ambiguity and accept
change. Must be able to plan and prioritize work - effective time
management is essential. Good communication skills required:
must be able to summarize significant information to concise executive
summaries and recommendations; must be able to communicate
effectively in written and spoken English when dealing with
colleagues world wide. Should be assertive and willing to challenge
others constructively to develop better solutions. Proficiency
with Microsoft Office and Excel is a must. Finally, must have
solid analytical skills and ability to objectively evaluate
alternative solutions.
Mechanical Engineer (CS)
Responsibility:
Mechanical Engineers research,
design, and develop mechanical and electro-mechanical devices
or systems. Responsibilities include development of system concepts,
conducting design previews, performing system acceptance, and
resolving design and implementation issues. Responds to customer/client
requests or events as they occur. Develops solutions to
problems utilizing formal education and judgement.
Requirements:
You should possess a relevant
educational qualification with strong technical knowledge
on mechanical system. Additional qualifications
include: quicker learner; fluent spoken English; systematic
problem solving capability; team spirit; customer orientated
Electrical Engineer (CS)
Responsibility:
Researches, designs, develops,
and tests a variety of electronic equipment and systems. Responds
to customer/client requests or events as they occur. Develops
solutions to problems utilizing formal education and judgement.
Requirements:
You must possess a
technical degree in a related discipline. Additional qualifications
include: strong technical knowledge in electrical
systems; fast learner; proficiency in written
and spoken English; excellent problem solving skills; ability
to work well in a diverse team environment; customer orientated
Chemical Engineer (CS)
Responsibility:
Lead chemical system(RO/DI,
waste waster treatment, water treatment) reliability improvement.
Be the technical expertise in project & TI design, HOC(hand
over & commissioning) & sustaining. Provide technical (chemical related) support
for operation. System capacity forecast and trigger strategic upgrade project.
Monitor FMMS supplier performance to ensure reliable operation achieved. Participate
in cost saving project to overall manager the budget of chemical system
Requirements:
You must possess strong technical
knowledge in chemical systems. Additional qualifications include:
fast learner; proficiency in written and spoken English; excellent
problem solving skills; outstanding team spirit; excellent customer
orientation
The following positions are located at Intel
offices in different cities
Retail Marketing Manager – Beijing, Guangzhou,
Chongqing, Xi’an & Harbin
Responsibility:
Serve as the marketing interface
between Intel and Retail Channel Customers in the Perspective
Regions. Develop and execute with agency support Intel Retail /
Channel Marketing Programs to achieve Intel business/marketing
goals. Focus on the three tenets of Retail Marketing : Branding,
Channel Advocacy
and Demand Generation. Build Intel brand equity by ensuring optimal
usage of the outdoor retail branding, retail store merchandizing
and by incorporating strong Intel messaging into the regional.
OEM plans. Maximize Intel Retail Channel Advocacy through regular
local OEM communications, bi-annual Channel Round Tables, and
regular RSP Training. Manage deployment / execution agency to ensure
operation excellence and meeting Intel quality standards. Drive
local and regional team alignment especially with RCO team and
internal CMG stakeholders Drive internal CMG integration on Campus
Roadshow
Requirements:
MBA candidates who will graduate
in 2005. At least 2 years working experience in sales or marketing
territory before taking MBA programs. Strong communication and
presentation skills. High level of maturity to interact with
both internal and external customers. Fluent in English (written
and spoken). Passion for business
Field Sales Engineer – Shenzhen
Responsibility:
Drive and support communication
business with distributors. Develop new business in key accounts
or potential application segments. Understand market and customers’
requirements and propose programs to align support strategy
between Intel and customers.
Requirements:
Candidates for Master of Science
in Electronic Engineering who
will graduate in 2005. Willing to travel frequently.
Have at least 2 years working experience before taking full-time
master courses. Strong communication and presentation skills.
High level of maturity to interact with both internal and external
customers. Fluent English (written and spoken). Aggressive
and willing to learn. Enjoy team work under multitasking working
environment.
Field Application Engineer – Beijing
Responsibility: Field Application Engineer
working under PRC Cellular and Handheld Sales District (CHSD) team,
responsible to promote Intel's integrated cellular and handheld
solutions at major phone makers, handheld device makers etc. in
PRC/HK. The job will require interaction with divisions’ marketing
and technical teams, ADC, WCC and Intel IA team to supporting
all Intel’s products with CHG
(cellular and handheld Group) and FPG (flash
Product Group) products focused.. It is essential the FAE works
closely with their sales counterparts to create coherent sales
strategies and provide feedback to the BU to ensure product feature
sets performance and roadmaps match customer/market and regulatory
requirements. It may be required to provide on-site design-in
assistance to review designs, examine problems, and provide
suggestions on optimal use of Intel's products.
This is a field based position requiring regular
travel within PRC.
Requirements: The successful candidate will
be required to be technical "expert" and "consultant" to
field account teams as well as to customers to help drive DESIGN WIN opportunities
to conclusion, will have detailed understanding of 2.5/3G phone architecture/xScale
or ARM based processor with particular emphasis on software and associated development
tools, specifically MS Platform builder, Linux tools, ADS tools etc. GSM/GPRS/3G
protocol and Multimedia knowledge would be a big plus. Experience in designing,
debugging and validating 2.5G/3G phone designs from concept to volume production.
Master of Science or Engineering (or equivalent) candidates who will graduate
in 2005. Have at least 2 years working experience before taking full-time master
courses. Excellent communication and presentation skills in both Mandarin and
English. Self-motivated. Disciplined
Retail & Channel Sales – Beijing, Shenyang
Responsibility: Develop and implement business
strategies. Explore new business opportunities. Customer coverage
in assigned territories. Meet/exceed revenue target assigned.
Requirements: MBA degree. At least 2 years working experience
in sales or marketing territory before taking MBA program. Strong
communication and presentation skills. High level of maturity to
interact with both internal and external customers. Fluent in English
(written and spoken). Passion for business.
Customer Business Analyst – Shenzhen
Responsibility: A Customer Business Analyst
(CBA) is responsible for supporting customers by managing the supply
pipeline from the customer demand through the delivery of product.
It involves:
- understanding and analyzing customer demand
vs. Intel supply status to provide recommendation;
- understanding
Intel’s product roadmap and sales & marketing strategies to influence customer business decision
- understanding customer sales & marketing
strategies,
market
environment
and
competition
to
identify
potential
risks
and
opportunities;
processing
customer
purchase
orders
and
changes;
- delivering
right
products
at
the
right
time
to
maintain
integrity
of
delivery
commitments;
and
- resolving
customer
issues
and
problems
with
total
ownership
for
specified
customers
adhering
to
Intel’s
established
policies
and
procedures.
CBA
has
to
work
with
multiple
groups
both
externally
(i.e.
the
customer,
freight
carriers)
and
internally
(i.e.
sales,
marketing,
logistics,
credit,
finance).
Requirements: Master/Bachelor
students
who
will
graduate
in
2005;
MBA
is
preferred
Have
relevant
intern/part
time
experience
in
multi-national
companies.
Excellent
command
of
spoken
and
written
English
and
Mandarin
is
a
must.
Fluency
in
Korean
or
Indian
is
an
added
advantage.
Fluency
in
other
languages
(e.g.
Japanese,
Thai
etc)
is
optional.
High
proficiency
in
PC
and
hands-on
experience
in
Microsoft
Office/Outlook
For
more
information,
pls
visit www.intel.com/jobs/china and
submit
your
resume
to
staffing.shanghai@intel.com AND www.intel.com/jobs
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